About TCLAD

World Leader in Insulated Metal
Substrates and Circuits

Company Profile
History
Career
Privacy Policy
Disclaimer
Policies & Resources

History

1986~1996
1987

Bergquist Thermal Clad T1 Dielectric invented

1989

Patent Granted and Mass Production of Thermal Clad "T1"

1997~2007
1997

Mass production circuit manufacturing facility opened in Prescott Wisconsin

1997

QS9000 and ISO certificate

2001

HT Dielectric Release

2004

Copper Pedestal Technology Release

2008~2017
2009

HPL Dielectric Release and Major Facility expansion to 100k sq/ft.

2010

New High-Capacity Panel Line commissioned

2013

HR Dielectric Release

2014

Bergquist sold to Henkel

Henkel acquires Bergquist along with the thermal substrate's division.

2018~2021
2018

$9M facility & circuit Equipment Upgrade

2021

TCLAD Inc. Started

TCLAD Inc., a Delaware Corporation acquired the Thermal Clad division from Henkel AG & Company including all assets, business, facilities and technology of the Thermal Clad product line. Doing business in Prescott Wisconsin, Thermal Clad Laminates and IMS Circuits provide thermal management solutions for high power density applications"