World Leaders in Insulated Metal
Substrates and Circuits
Thermal Clad materials are designed for high temperature solder and ENEPIG surface finish for eutectic AuSn die attach to reduce thermal resistance in Inverter
Thermal impedance is the property that matters most in determining the power density capability of the application. Lower thermal impedance results in lower junction temperatures. The lower the thermal impedance the more efficiently heat transfer from the component to the heatsink.
|Thermal Property||HPL||SJR||HT||MP||Test Method|
Product Thermal Conductivity A
|W/m-k||7.5 B||3.7 C||4.1 D||2.4 E||TO-220|
Dielectric Thermal Conductivity
|Thermal Resistance||1.5mil (38µm)||°C-in²/W||0.02||-||-||-||ASTM D5470|
|Thermal Impedance||1.5mil (38µm)||°C/W||0.30||-||-||-||TO-220|
• The chart above represents some standard product offerings. There are new thicknesses and variants being developed.
Please inquire with your sales representative for more information
A Product thermal performance based on 1.6mm Al and 2oz copper. B Based on 1.5mil HPL. C Based on 4mil SJR. D Based on 3mil HT. E Based on 3mil MP.
Dielectric Breakdown Voltage
ASTM D149 definition of dielectric breakdown voltage is the potential difference at which dielectric failure occurs under prescribed conditions in an electrical insulating material located between two electrodes. This is a permanent breakdown and is not recoverable. Results obtained by this test should not be used to directly determine the dielectric behavior of a material in an actual application.
Note: Dielectric breakdown for PCB laminates is usually tested to IPC TM-650 test method 2.5.6 for breakdowns across the material and test method 220.127.116.11 for breakdown through the material; i.e., layer to layer.
|Electrical Property||HPL||SJR||HT||MP||Test Method|
|1.5mil (38µm)||KVAC||5.0||-||-||-||ASTM D149|
Tg / CTE
Relative to traditional FR4 materials containing fiberglass, the z-axis expansion of Thermal Clad is considerably lower. This reduced z-axis expansion combined with the thin nature of the Thermal Clad dielectric layer results in significantly less stress on plated through holes (PTH).
|Mechanical Property||HPL||HT||MP||HR||FR-4||Test Method|
|Glass Transition, Tg||°C||185||150||90||90||170||ASTM E1356|
|CTE in XY/Z Axis , < Tg¹||µm/m°C||35||25||40||25||60||ASTM D3386|
|CTE in XY/Z Axis , > Tg²||µm/m°C||85||95||110||95||250||ASTM D3386|