Applications

World Leaders in Insulated Metal
Substrates and Circuits

Application 1

Powertrain

Thermal CLAD® the thick copper or multi-structure help the maximize heat spreading.

Thermal CLAD® is providing direct die attach to maximize heat spreading.
Application 2

Automotive  Lighting

Thermal CLAD® the thick copper or multi-structure help the maximize heat spreading.

Thermal CLAD® is providing direct die attach to maximize heat spreading.
Application 3

Motion Controls

Thermal CLAD® the thick copper or multi-structure help the maximize heat spreading.

Thermal CLAD® is providing direct die attach to maximize heat spreading.
Application 4

On-Board Charger

Thermal Clad is supporting on-board charging applications that require high thermal performance and high-reliability circuit substrates

 

TCLAD's Thermal Clad is the leading global solution provider for thermal management Insulated Metal Substrates™. 

Providing robust, high quality thermal management dielectrics materials used in insulated metal substrates for your most demanding applications.

TCLAD's Thermal clad is a three layer system comprised of the following

  • Circuit Layer

    Using standard ED printed circuit foils with thicknesses ranging from 0.5oz to 10oz (17-350um).

  • Dielectric Layer

    The dielectric layer is thermally conductive with excellent electrical strength and is the bonding layer from the circuit to metal base.

  • Base Layer

    This is often aluminum, but other metals such as copper can be used. The base materials are available in a variety of standard gage thicknesses. Please contact us for specific thickness.

Product catalog

  • #1HPL

    Highest performance dielectric available if very thin, 38µm thickness for lower voltage applications, < 150 VDC, and up to 150µm for high voltage application <1200 VDC

  • #2HT

    Excellent thermal performance for single and two-layer applications

  • #3MP

    Standard thermal performance dielectric for lower operating temperature applications

  • #4SJR

    High thermal performance dielectric specifically designed to reduce fatigue stress caused from CTE mismatch between the aluminum base and the ceramic component

Applications

  • THERMAL CLAD: TOOLS FOR THE OPTIMAL DESIGN

    Circuit Design Guidelines
  • IMS Material Selection Guidelines