TCLAD's Thermal clad is a three layer system comprised of the following
Using standard ED printed circuit foils with thicknesses ranging from 0.5oz to 10oz (17-350um).
The dielectric layer is thermally conductive with excellent electrical strength and is the bonding layer from the circuit to metal base.
This is often aluminum, but other metals such as copper can be used. The base materials are available in a variety of standard gage thicknesses. Please contact us for specific thickness.