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World Leaders in Insulated Metal
Substrates and Circuits

Application 3

Motion Controls

Thermal Clad materials are used in semiconductor packages as well as custom power modules.

Thermal Properties

Thermal impedance is the property that matters most in determining the power density capability of the application. Lower thermal impedance results in lower junction temperatures. The lower the thermal impedance the more efficiently heat transfer from the component to the heatsink.

Thermal Property     HPL SJR HT MP Test Method
Thickness Unit Value Value Value Value

Product Thermal Conductivity A

  W/m-k 7.5 B 3.7 C 4.1 D 2.4 E TO-220

Dielectric Thermal Conductivity

  W/m-k 3.00 2.70 2.20 1.30 ASTM D5470
Thermal Resistance 1.5mil (38µm) °C-in²/W 0.02 - - - ASTM D5470
2mil (50µm) 0.03 - - -
3mil (76µm) - - 0.05 0.09
4mil (100µm) - 0.03 - -
6mil (152µm) 0.08 - 0.11 -
Thermal Impedance 1.5mil (38µm) °C/W 0.30 - - - TO-220
2.0mil (50µm) 0.40 - - -
3.0mil (76µm) - - 0.45 0.65
4.0mil (100µm) - 0.58 - -
6mil (152µm) 0.58 - 0.70 -

• The chart above represents some standard product offerings. There are new thicknesses and variants being developed.
Please inquire with your sales representative for more information
A Product thermal performance based on 1.6mm Al and 2oz copper

Electrical Properties

Dielectric Breakdown Voltage

ASTM D149 definition of dielectric breakdown voltage is the potential difference at which dielectric failure occurs under prescribed conditions in an electrical insulating material located between two electrodes. This is a permanent breakdown and is not recoverable. Results obtained by this test should not be used to directly determine the dielectric behavior of a material in an actual application.

Note: Dielectric breakdown for PCB laminates is usually tested to IPC TM-650 test method 2.5.6 for breakdowns across the material and test method for breakdown through the material; i.e., layer to layer.

Electrical Property     HPL SJR HT MP Test Method
Thickness Unit Value Value Value Value
1.5mil (38µm) KVAC 5.0 - - - ASTM D149
2.0mil (50µm) 7.7 - - -
3.0mil (76µm) - - 8.5 8.5
4.0mil (100µm) - 9.2 - -
6mil (152µm) 17.4 - 11.0 -
9mil (225µm) - - 20.0 -

Mechanical Properties

Tg / CTE
Relative to traditional FR4 materials containing fiberglass, the z-axis expansion of Thermal Clad is considerably lower. This reduced z-axis expansion combined with the thin nature of the Thermal Clad dielectric layer results in significantly less stress on plated through holes (PTH).

Mechanical Property   HPL HT MP HR FR-4 Test Method
Unit Value Value Value Value Value
Glass Transition, Tg °C 185 150 90 90 170 ASTM E1356
CTE in XY/Z Axis , < Tg¹ µm/m°C 35 25 40 25 60 ASTM D3386
CTE in XY/Z Axis , > Tg² µm/m°C 85 95 110 95 250 ASTM D3386

Technical Resources

  • #1HPL

    Highest performance dielectric available if very thin, 38µm thickness for lower voltage applications, < 150 VDC, and up to 150µm for high voltage application <1200 VDC
  • #2HT

    Excellent thermal performance for single and two-layer applications
  • #3MP

    Standard thermal performance dielectric for lower operating temperature applications
  • #4SJR

    High thermal performance dielectric specifically designed to reduce fatigue stress caused from CTE mismatch between the aluminum base and the ceramic component



    Circuit Design Guidelines
  • IMS Material Selection Guidelines