Technical Information

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Substrates and Circuits

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IMS (Insulated Metal Substrate) & Laminating Materials 

Without FiberGlass

         

With FiberGlass

     

High Performance

     

Series

Sub

Groups

1.6 W/m-k

 1.7 W/m-k

 2.75 W/m-k

3.2 W/m-k

 

Series

Sub

Groups

 1.85 W/m-k

 2.8 W/m-k

 

Series

Sub

Groups

 2.2 W/m-k

3.0 W/m-k

10 W/m-k

IMS

SFL

SFL-3E

SFL-3

SFL-8

SFL-12

 

IMS

SFLG

SFLG-8

 SFLG-12

 

IMS

SPL

HT

HPL

SPL-15

PP

SFP

SFP-3E

SFP-3

SFP-8

SFP-12

 

PP

SFPG

SFPG-8

SFPG-12

 

PP

SPP

-

-

SPP-15

RCC

SFR

SFR-3E

SFR-3

SFR-8

SFR-12

 

RCC

SFRG

SFRG-8

SFRG-12

 

RCC

SPR

-

-

SPR-15

TCS

SFT

SFT-3E

SFT-3

SFT-8

SFT-12

 

TCS

SFTG

SFTG-8

SFTG-12

 

TCS

SPT

-

-

SPT-15

 

TIM Thermal Interface Material (Silicone Based)

 

 

Silicone TIM Series

1 W/m-K

2 W/m-K

3 W/m-K

W/m-K

W/m-K

W/m-K

W/m-K

W/m-K

10 W/m-K

12 W/m-K

TCFP Pad Series
(Thermal Conductive Filler Pad)

 

TCFP 2.0

TCFP 3.0

 

TCFP 5.0

TCFP 6.0

 

TCFP 8.0

 TCFP 10.0

 TCFP 12.0

TCF Filler (2K) Series
(Thermal Conductive Filler Liquid)  

 

TCFL 2.0

TCFL 3.5

 

TCFL 5.0
TCFL 5.0 RW

TCFL 6.5

 

TCFL 8.0

 

 

TCGS Grease Series
(Thermal Conductive Grease) 

 

TCGS 2.0

TCGS 3.5

 

TCGS 5.0

TCGS 6.0

 

 

 

 

PCM Series
(Phase Change Material)

 

 

PCM 3.5

 

 

 

 

PCM 8.5

 

 

HCA Series

(Thermal Adhesive) 

 

 HCA 2.0

 

 HCA 4.0

 

 HCA 5.0

 

 

 

 

 

 

TCGL Gel (1K) Series
(Thermal Condutive Gel)  

 

 

 

TCGL 4.0 LO

 

 

TCGL 7.0

 

TCGL 10.0

 TCGL 12.0

TPM Series
(Thermal Potting Material)

TPM 0.5

TPM 1.0

TPM 2.0

TPM 3.0

 TPM 4.0

 

 

 

 

 

 

TIP Series
(Thermal Insulation Pad)

TIP 1.0
TIP 1.6

 

TIP 3.5

 

 

 

 

 

 

 

 

LP = Low Dk  

RW= Reworkable 

LO = Low Outgassing 

LV = Low Voltaile 

LX = Low Outgassing & Low Voltaile

 

Thermal Conductive Ink

 

 

 

Liquid Epoxy TIM Series

1 W/m-K

W/m-K

W/m-K

W/m-K

W/m-K

W/m-K

W/m-K

W/m-K

10 W/m-K

12 W/m-K

1K (1 part) 

 

             

 

 

B Series 

 

TCI-B-C40(1.5)

TCI-B-C160(2.5)

 TCI-B-C260(3.0)

       

 

 

G Series 

 

           

 TCI-G-1000

 

 

2K (2 parts) 

 

 

             

 

C series 

 

TCI-C60B-2K                

 

 

Thermal Settable Pad

 

 

Epoxy Film TIM Series

W/m-K

W/m-K

W/m-K

W/m-K

W/m-K

W/m-K

W/m-K

W/m-K

10 W/m-K

12 W/m-K

TSP Series (Epoxy) 

 

  TSP-3(3.0)         TSP-8(8.0)

 

 

TSPF-H Series (FKM) 

 

            TSPF-H(8.6)

 

 

 

Thermal Bridge

SMTB Thermal Bridge TDS

 

 

Technical Guides

 

Safety Datasheets SDS

TCLAD Comprehensive Selection Guide  
Optimal Design WP
 

 

Technical Papers

TPG Paper

Partial Discharger Paper